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Please refer to the Launch Date for market availability. Listing of these RCP does not constitute a formal pricing offer from Intel. Prices may vary for other package types and shipment quantities. This specific part is no longer being manufactured or purchased and no inventory is available. System and Maximum TDP is based on worst case scenarios. By using this site, you agree to the Terms of Use and Privacy Policy.

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Refer to Datasheet for formal definitions of product properties and features.

Super Micro Computer, Inc. – Products | Motherboards | Xeon Boards | X7DBE+

Integrated graphics allow for incredible visual quality, faster chlpset performance and flexible display options without the need for a separate graphics card. Please contact system vendor for more information on specific products or systems. To be well prepared to feed current and upcoming processors’ heavy compute intensive tasks, the Intel series chipset is also the first DP platform to feature dual independent buses DIB to the processors.

Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Intel refers to backford processors as tray or OEM processors.

System and Maximum TDP is based on worst case scenarios. This specific part is no longer being manufactured or purchased and no inventory is available. Views Read Edit View history. Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. You will receive a reply within 2 business days. The Intel series MCH chip package.


We refer to these processors as boxed processors. To make it even more palatable, all of these processors will use the same packaging and pin-out to ensure compatibility with the LGA socket and allow direct drop in upgrades along the way as long as the board’s BIOS is qualified to support them. Add to Compare Shop for this product. PCI Express Revision is the version supported by the processor.

Graphics Output defines the interfaces available to communicate with display devices. Thank you for your feedback.

Note that the P2 chips mentioned above were initially designed for the Intel chipset for Itanium 2, and that the summary page of the E datasheet incorrectly claims three PCI Express interfaces. Note that ECC memory support requires both processor and chipset support. Your personal information will be used to respond to this inquiry only. Please submit your comments, questions, or suggestions here. Your name and email address will not be added to any mailing list, and you will not receive email from Intel Corporation unless requested.

Intel Xeon chipsets – Wikipedia

InfoWorld Media Group, Inc. Prev Page chispet of Peripheral Component Interconnect Express or PCIe is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The divergence was implemented by using different sockets; since then, the sockets for Xeon chips have tended to remain constant across several generations of implementation. The number of memory channels refers to the bandwidth operation for real world application.


Its core contains more transistors than an old Pentium 4 processor – mind boggling indeed!

Intel Xeon chipsets

The information herein is provided “as-is” and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.

Physical Address Extensions PAE is a feature that allows bit processors to access a physical address space larger than 4 gigabytes. Prices may vary for other inteo types and shipment quantities, and special promotional arrangements may apply.

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